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Vacuum Technology

Most of the instruments in this course share the same foundation: a stainless steel chamber pumped to somewhere between 10-6 and 10-11 Torr. Vacuum serves two distinct purposes. It keeps the sample surface clean on the timescale of the measurement, as quantified on the previous page, and it gives probe particles (electrons, ions, and the particles they knock loose) a collision-free path from source to sample to detector. This page covers the working knowledge of vacuum practice: gas kinetics, regimes, conductance and pumping, gas loads, pumps, and gauges. Every surface scientist ends up needing this material.

Gas kinetics

A gas at pressure PP and temperature TT has molecular density n=P/kBTn = P/k_BT, about 2.5×10192.5 \times 10^{19} molecules per cm3^3 at atmosphere and room temperature, and mean molecular speeds of hundreds of meters per second (about 470 m/s for N2_2 at 300 K). Two derived quantities do most of the work in vacuum arithmetic. The impingement flux onto any surface follows from integrating the Maxwell-Boltzmann distribution over molecules moving toward it:

Φ=14nvˉ=P2πmkBT,\Phi = \frac{1}{4} n \bar{v} = \frac{P}{\sqrt{2\pi m k_B T}},

where Φ\Phi is the number of molecules striking unit area per unit time, nn the gas number density, vˉ\bar{v} the mean molecular speed, PP the pressure, mm the mass of one molecule, kBk_B the Boltzmann constant, and TT the temperature. The mean free path between molecule-molecule collisions is

λ=kBT2 πd2P,\lambda = \frac{k_B T}{\sqrt{2}\, \pi d^2 P},

with λ\lambda the mean distance a molecule travels between collisions and dd the molecular diameter (0.37 nm for N2_2): about 70 nm at atmosphere, roughly 5 cm at 10-3 Torr, and 50 km at 10-9 Torr. Note what appears in each: the flux measures how often gas molecules strike the sample, the mean free path measures how far they travel between collisions with each other, and the two answer different experimental questions.

The conventional regimes:

RegimeTorrmbarPaCharacter
Rough vacuum760 to 10-3103 to 10-3105 to 10-1Viscous flow: molecules collide with each other; pump-down and load locks
High vacuum (HV)10-3 to 10-810-3 to 10-810-1 to 10-6Molecular flow: molecules collide only with walls; electron microscopes, deposition tools
Ultrahigh vacuum (UHV)below 10-8below 10-8below 10-6Surfaces stay clean for hours; surface analysis

Three units are in daily use and you will meet all of them: 1 Torr = 1.333 mbar = 133.3 Pa, and 1 atm = 760 Torr = 1013 mbar = 101325 Pa. Torr and mbar are within a third of each other, which is why the regime boundaries look the same in both.

The crossover from viscous to molecular flow happens when λ\lambda exceeds the chamber dimensions (the Knudsen criterion). In the molecular regime, gas has no collective behavior: each molecule flies ballistically between wall bounces, “pumping” means capturing molecules at surfaces rather than pushing a fluid, and gas moves through tubes only by the random chance of a molecule finding the far end.

viscous flow against molecular flow in a tube

The two flow regimes. When the mean free path is short against the tube, molecules collide with each other and the gas behaves as a fluid; when it is long, each molecule flies wall to wall on its own.

For any charged-particle instrument the beam path is effectively collision-free once the pressure is below roughly 10-5 Torr; the much harder UHV requirement comes entirely from surface cleanliness, and instruments that do not care about surface contamination (a conventional SEM, for example) run comfortably at high vacuum.

The monolayer formation time

The single most useful number in vacuum practice is the time to form one monolayer of adsorbed gas. Dividing a monolayer’s worth of sites (about 1015 per cm2^2) by the impingement flux, with sticking coefficient one, gives for room-temperature nitrogen the rule of thumb

tML≈3×10−6P seconds, with P in Torr.t_{\mathrm{ML}} \approx \frac{3 \times 10^{-6}}{P}\ \text{seconds, with } P \text{ in Torr}.

with tMLt_{\mathrm{ML}} the time to accumulate one monolayer. At 10-6 Torr a monolayer forms in seconds; at 10-10 Torr it takes on the order of ten hours. Surface-sensitive spectroscopy (XPS, AES, LEIS) and atomically resolved surface imaging (STM, LEED) therefore live in UHV, and every discussion of a technique in this course will note how demanding its vacuum requirements really are. Real sticking coefficients are below one and depend on the gas and surface, so these are worst-case times; they are still the right planning numbers, because the residual gas in a UHV system is dominated by exactly the reactive species (water, CO, hydrogen) that stick well. The calculator below carries the full arithmetic across the pressure range; sliding from atmosphere to UHV, fourteen orders of magnitude, is the fastest way to internalize why vacuum hardware dominates surface analysis.

Vacuum calculator

Conductance, pumping speed, and gas load

pumping as a resistor network, in series and in parallel

Pumping arithmetic as a resistor network. Left: a pipe and a pump in series, so their reciprocals add. Middle: two paths in parallel, so their conductances add. Right: conductance goes as the cube of the bore, which is why a wider pipe beats a bigger pump.

Vacuum systems are bookkept exactly like resistor networks. A pipe passes a throughput Q=C ΔPQ = C\,\Delta P, where QQ is the gas load in Torr·L/s, ΔP\Delta P the pressure difference across the pipe, and CC its conductance in L/s, so the gas load plays the part of the current, the pressure difference the part of the voltage, and the conductance the part of 1/R1/R. A pump is rated by its pumping speed SS (volume per unit time, liters per second) and is simply one more element in the chain, so conductances in a line add as reciprocals while conductances side by side add directly:

P=QSeff,1Seff=1S+1C,Cparallel=C1+C2,P = \frac{Q}{S_{\mathrm{eff}}},\qquad \frac{1}{S_{\mathrm{eff}}} = \frac{1}{S} + \frac{1}{C},\qquad C_{\mathrm{parallel}} = C_1 + C_2,

with PP the steady-state pressure the chamber settles at and SeffS_{\mathrm{eff}} the effective speed the chamber actually sees, which the smaller of SS and CC controls. A pumping speed and a conductance share units, liters per second, because a pump behaves like a conductance leading to a perfect vacuum. The pump removes a volume SS of gas per second from its inlet, where the pressure is PpumpP_{\mathrm{pump}}, so it carries Q=S Ppump=S (Ppump−0)Q = S\,P_{\mathrm{pump}} = S\,(P_{\mathrm{pump}} - 0), the same relation as Q=C ΔPQ = C\,\Delta P for a pipe. The same gas load passes through the pipe and then into the pump, so the pump inlet sits at Ppump=Q/SP_{\mathrm{pump}} = Q/S. The pipe needs a pressure difference P−Ppump=Q/CP - P_{\mathrm{pump}} = Q/C to carry the same gas, and adding the two gives P=Q/C+Q/S=Q/SeffP = Q/C + Q/S = Q/S_{\mathrm{eff}}, exactly as two resistors in series add, with 1/C1/C and 1/S1/S as the resistances. Molecular-flow conductance is set by geometry alone: for an orifice it is proportional to the area times the mean molecular speed, and for a long tube carrying air at room temperature it is C≈12 d3/LC \approx 12\,d^3/L L/s with the diameter dd and the length LL in cm. The cube is the part worth remembering, since doubling the bore multiplies the conductance by eight while a second identical pipe alongside only doubles it. Hence the cardinal design rule: short, fat connections to pumps, because a long thin bellows can throttle an expensive pump to a fraction of its rated speed, and no larger pump can fix a conductance-limited system.

The gas load QQ has several sources, and which one dominates changes with pressure. Initial pumpdown removes the chamber volume (fast, exponential). What remains is outgassing: gas desorbing from every internal surface, overwhelmingly water in an unbaked chamber, which desorbs so slowly at room temperature that an unbaked system stalls near 10-8 Torr no matter how long it pumps. This is why UHV systems are baked, typically at 120 to 200 °C for many hours while pumping, to drive the water off the walls; after cooldown the residual gas is dominated by hydrogen diffusing out of the bulk of the stainless steel itself, the ultimate background of most UHV systems. Beyond outgassing sit true leaks (openings to atmosphere), virtual leaks (trapped volumes such as unvented screw holes that release gas slowly), and permeation through elastomer seals, which is why UHV practice replaces elastomer O-rings with knife-edge copper-gasket (ConFlat) seals, uses low-vapor-pressure materials throughout, and treats fingerprints as a contamination source on par with a leak.

Pumps

No single pump spans from atmosphere to UHV, so real systems chain several:

A typical analysis system combines a load lock (so samples enter without venting the analysis chamber), turbo plus dry roughing on the transfer line, and ion plus titanium sublimation pumping on the baked UHV chamber. What each level of hardware reaches, with rough costs for the vacuum hardware alone (chamber, pumps, and gauges, not the instrument mounted on it):

HardwareBase pressure (Torr)Rough cost
Elastomer seals, scroll or rotary pump only10-3a few thousand
Elastomer seals, turbo backed by a dry pump, unbaked10-6 to 10-7ten to thirty thousand
ConFlat metal seals, turbo, unbaked10-8fifty thousand and up
ConFlat, baked, turbo plus ion pump and TSP10-10 to 10-11one to several hundred thousand
Baked, vacuum-fired or NEG-coated steel, all-metal valvesbelow 10-12specialist research systems

The expensive stretch is 10-7 to 10-10, and most of what the money buys there is not pumping speed: it is metal seals, materials chosen for low outgassing, and a bakeout that takes the chamber out of service for a day or two every time it is opened. That is the real price of surface sensitivity, and it is why a technique that tolerates high vacuum costs so much less to run.

working ranges of vacuum pumps and gauges

The vacuum regimes with the working range of every common pump and gauge. No single pump or gauge spans the range, which is why systems are staged.

Gauges and residual gas analysis

Pressure measurement changes physics across fourteen decades. Near atmosphere, capacitance manometers measure the actual force on a diaphragm (gas-species independent, the metrology standard). In rough vacuum, Pirani gauges infer pressure from the thermal conductivity of the gas. From high vacuum down, ionization gauges take over: a hot filament emits electrons that ionize residual gas, and the collected ion current is proportional to density. The Bayard-Alpert design, with its fine-wire collector, reads reliably to below 10-10 Torr, with two caveats worth remembering: readings are species-dependent (calibrated for N2_2), and the hot filament itself pumps and outgasses slightly.

three residual gas spectra: air leak, unbaked chamber, baked chamber with oil

Three residual gas spectra, drawn as peak height against mass-to-charge ratio. An air leak puts masses 28 and 32 in the 4:1 ratio of air with argon at 40; an unbaked chamber is water at 18 with its 17 and 16 fragments; a baked system sits on hydrogen at 2, and the ladder at 41, 43, 55, 57 is pump oil.

The most informative vacuum instrument is the residual gas analyzer (RGA), a small quadrupole mass spectrometer (the same analyzer physics as SIMS) that reports which gases remain. Reading an RGA spectrum is a core lab skill, and one thing has to be understood before the spectrum makes sense: the ionizer uses electrons of about 70 eV, which both ionize molecules and break them apart, so each gas gives a fixed pattern of fragment peaks rather than a single line. That pattern is the cracking pattern, and it is what separates two gases at the same nominal mass.

GasPeaks at m/zm/zWhat it tells you
H2_22The floor of a well-baked stainless system: hydrogen diffusing out of the steel
H2_2O18, with 17 (OH) and 16 (O)Wall outgassing in an unbaked chamber, the dominant load below 10-6 Torr
N2_228, with a small 14 (N)Air, if 32 and 40 come with it
O2_232Only comes from air
Ar401% of air, so about 1% of the 28 peak
CO28, with 12 (C) and 16 (O)Baked systems and electron-stimulated desorption, not a leak
CO2_244, with 28, 16, 12Bake product
Hydrocarbonsladder at 41, 43, 55, 57 and upPump oil backstreaming, or a dirty part

Mass 28 is the one to be careful with, because N2_2 and CO sit on top of each other: the 12 and 16 fragments with no 32 say CO, while 32 and 40 companions say air. A leak shows N2_2 and O2_2 in their 4:1 atmospheric ratio, while outgassing shows water, and this single diagnostic separates the two most common vacuum problems in minutes.

References and further reading

  1. J. F. O’Hanlon, A User’s Guide to Vacuum Technology, 3rd ed., Wiley (2003). The standard practical reference for everything on this page.

  2. K. Oura et al., Surface Science: An Introduction, Springer (2003), Chapter 2.

  3. L. C. Feldman and J. W. Mayer, Fundamentals of Surface and Thin Film Analysis, North-Holland (1986), Chapter 1.